Our Technology

 

Our Technology

ASIC’s

  • Low Power, low volt ASIC (down to 0.9V)
  • High power, high volt design /up to 650V)
  • Analog and mixed signal design
  • CMOS, BiCMOS, BCD technologies
  • Low quantity to high quantity
  • Analog digital CMOS Array to Full Custom

Modules

  • Wire Bonding technoligies
  • Flip-Chip technologies
  • Bumping technologies
  • SMD technologies
  • Hybrid technologies
  • PCB technologies
  • Film technologies
  • Glass technologies
  • Insulated metal substrate technologies